Design Guidelines
Design Guidelines
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Technical Question
| Item | Mass Production | Try Run |
|---|---|---|
| Layers | 32 | 42 |
| Min line / space | 40/40um (1.6/1.6mil) | 35/35um (1.4/1.4mil) |
| Min. laser drill diameter | 70um (2.8mil) | 65um (2.6mil) |
| Aspect ratio of PTH | 16:01 | 18:01 |
| Min .core thickness (excluding copper) | 40um(1.6mil) | 30um(1.2mil) |
| Any layer interconnect | 5+2+5 | 6+2+10 |
| Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |
| Surface Finish | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink |
