Design For Manufacturability
Stackup Design:
Controlled Impedance Modeling
Blind & Buried Vias (Sequential Lam)
Micro Via build up
Controlled Dielectrics.
Design for Manufacturability:
Feedback on your PCB designs.
Netlist Compare, Drill Checks.
Inner and Outer layer trace and
space.
Soldermask Legend and Profile.
Link toCapability info.
